SMD/GOB/COB/MIP Packaging Technologies for LED Displays: Principles, Pros & Cons, Selection Guide
SMD refers to the traditional standard process. GOB is a protective coating solution that adds a protective shield to SMD modules. COB is a technology that directly bonds bare RGB chips onto PCB boards and encapsulates the entire surface as a whole. MIP is a solution where Mini/Micro LED chips are mass transferred, sorted and color-mixed to form standalone miniature LED components, which are then mounted on PCB substrates via mature SMT processes.
LED Display Technology Guide – How to Pick the Suitable Pixel Pitch for LED Displays
LED display pixel pitch (marked as P value, e.g. P2, P3) shall be selected according to viewing distance: smaller P for close viewing, larger P for long-distance viewing.