COB LED Module
HMT Display’s 320 × 160 mm COB LED module uses full flip-chip packaging with an encapsulated surface for fine-pitch indoor LED displays. Available in P1.25, P1.538 and P1.8605, it is suitable for close viewing in control rooms, meeting rooms and other high-resolution indoor applications.
- 320 × 160 mm standard format
- P1.25–P1.8605 pixel pitches
- Full flip-chip COB process
- 10000:1 contrast ratio
- 2-Year Warranty
- CE,RoHS,FCC Approved
Product Overview
What Is a COB LED Module?
A COB LED module mounts red, green and blue LED chips directly onto the PCB and then encapsulates the LED surface. Unlike a conventional SMD module, it does not use separate packaged LEDs, which allows a more compact pixel structure for fine-pitch displays.
The encapsulated surface covers the LED chips and helps protect them from moisture, dust, static electricity and accidental contact. It is commonly used for indoor displays that need close viewing and high pixel density.
Full Flip-Chip COB Structure
In a full flip-chip COB design, the chip electrodes face the PCB and connect directly to the board without external bonding wires. This shortens the electrical connection path and helps with compact pixel layout and heat transfer.
The final module performance also depends on the PCB, driver IC, power design and calibration.
COB Packaging Technology
COB technology mounts LED chips directly onto the PCB and encapsulates the LED surface. The modules on this page use a full flip-chip structure, with the chip electrodes connected directly to the PCB pads without external bonding wires.
Fine-Pitch COB LED Module Features
Standard Module Structure
The COB LED module uses a standard 320 × 160 mm size with a rear shell and mounting-hole layout compatible with common SMD module structures. It supports magnetic mounting and can also be installed in a 640 × 480 mm die-cast aluminum cabinet.
Super strong stability
This COB LED display module product uses a full flip-chip COB process, with no packaging bracket and no bonding leads, featuring ultra-precision design. The surface is encapsulated with a high polymer, greatly enhancing the stability and lifespan of the MicroLED display, effectively reducing the failure rate, with the pixel failure rate of the entire screen being less than three in a million!
Super wide angle
This COB LED display module has an ultra-wide viewing angle, with horizontal/vertical angles greater than 175°, allowing for a larger viewing range, and it has no color shift or dead spots, providing a perfect visual experience.
Ultra-high contrast
The surface of the COB module uses an ultra-black flexible polymer coating, which has a deeper black and can achieve an ultra-high contrast ratio of 10000:1; it can better display the layering and details of colors, prevent detail loss, and make the images clearer, fuller, and more realistic.
Product Parameters
COB LED Display Module
| Pixel Pitch(mm) | Module Size (mm) | Module Resolution (Pixel) | LED Chip Process | Driving Mode (Duty) | Density (Pixels/㎡) | Refresh Frequency (Hz) | Brightness (nit) |
|---|---|---|---|---|---|---|---|
| P1.25 | 320x160 | 256x128 | Fully Flipped Chip | 1/64 Scan | 640000 | 3840Hz | ≤800 |
| P1.538 | 320x160 | 208x104 | Fully Flipped Chip | 1/52 Scan | 422500 | 3840Hz | ≤800 |
| P1.8605 | 320x160 | 172x86 | Fully Flipped Chip | 1/43 Scan | 288906 | 3840Hz | ≤800 |
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Product Images
Indoor LED Module
Indoor LED Module
Indoor LED Module
Product Videos
Product Case
Emergency Management Center
Smart City
Medium and large conference rooms
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